Corner Radius of cavity within 4 μm, for Connector Mold | NEUAR EDM
As electronic products continue to evolve toward higher precision and miniaturization, machining demands are becoming increasingly stringent. For fine structures, NEUAR’s latest wear-suppression technology delivers exceptional performance with a minimum corner radius as small as 5 μm, making it especially well-suited for the precision electronic connector industry. AE II core tech delivers powder-free mirror finish to Ra 0.06–0.08 µm, 5 µm corners, ±10% Ra control and 18 m/min Z-jump for deep holes. See HQM2, SPRUE & book a demo.
Corner Radius of cavity within 4 μm, for Connector Mold
Core Technologies of High-Speed Mirror EDM Machines
As electronic products continue to evolve toward higher precision and miniaturization, machining demands are becoming increasingly stringent. For fine structures, NEUAR’s latest wear-suppression technology delivers exceptional performance with a minimum corner radius as small as 5 μm, making it especially well-suited for the precision electronic connector industry.
Machining Case Study
Ultra-Low Wear EDM Technology + Micro Discharge Circuit
Equipped with AE II "Low-Wear Circuit (LW2)" and "Micro Discharge Circuit (MG)", enabling ultra-small corner R radius machining.
Expert system Connector modules
- Built-in specialized machining condition packages automatically provide the optimal solution based on different requirements:
- Intelligent suggestions for suitable corner radius (R) and number of electrodes.
- Automatic selection of optimal machining parameters — no manual setup needed.
- Auto-generation of displacement coordinates for precise and efficient processing. When combined with the ATC system, it can efficiently handle multiple machining positions.
Machining Case Study： Connector mold machining data
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Download Corner Radius of cavity within 4 μm, for Connector Mold | NEUAR EDM
The new AE II discharge power system breaks past limits and streamlines programming in 5 steps. Achieve ultra-fine mirror surfaces around Ra 0.06–0.08 µm without adding powder; HQM2 expands large-area finishing, cutting post-polish time and cost.
SPRUE module targets mirror-finish angled gates with excellent stability. AE II auto-generates Z-axis linear and 3-axis paths; the C-axis refines angles for precision molds. For IC packaging molds, the large-area fine circuit keeps overall Ra within ±10% of target—ideal for high-density, tight-tolerance tooling.
Hard-alloy circuits suppress wear on ultra-hard materials; SH2’s tungsten-carbide thread circuit completes internal threads with a single electrode. High-speed gap monitoring speeds graphite electrode finishing, while EtherCAT control enables Z-axis jumping to 18 m/min for efficient deep-hole machining—request tech notes or a live demo.
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