Latest Gap Control Technology

Equipped with "Large Area Finishing circuit(LAF)", can achieve stable and high machining speed in large area.
• High Stability: Precisely controls the discharge gap to ensure a smooth and uninterrupted processing.
• High-Speed Processing: Enhances efficiency and shortens processing time.
• Consistent Surface Quality: The overall roughness in large-area processing can be consistently controlled within a ±10% deviation from the target Ra value.

Flatness within 5 μm
Exceptional precision machining capability, meeting the extremely high accuracy requirements of semiconductor processes.

The most suitable surface texture for semiconductor packaging

The expert system is equipped with intelligent processing capabilities for semiconductor multi-hole machining requirements:
• Automatic selection of the optimal processing conditions: Based on the processing area, it automatically matches the most suitable parameters without the need for manual adjustments.
• Simplified operation process: Reduces setup time and improves processing efficiency.
This module is specifically designed for semiconductor processing, ensuring stability and high performance, allowing you to focus on your core production and easily achieve high-quality results