144 Cavities of Semiconductor Packaging Mold | NEUAR EDM
With the rapid development of the semiconductor industry, electronic products are evolving toward higher capacity, greater density, and lighter designs. Packaging solutions are also trending toward multi-lead configurations, thinner profiles, and finer lead pitches. As product designs become more compact, tolerances continue to tighten, placing increasingly stringent demands on manufacturing precision. The 144-cavity semiconductor packaging mold sample exemplifies a uniformly fine and consistent surface finish that meets these high-precision requirements. AE II core tech delivers powder-free mirror finish to Ra 0.06–0.08 µm, 5 µm corners, ±10% Ra control and 18 m/min Z-jump for deep holes. See HQM2, SPRUE & book a demo.
144 Cavities of Semiconductor Packaging Mold
Core Technology of Automated High-Speed EDM Machines
With the rapid development of the semiconductor industry, electronic products are evolving toward higher capacity, greater density, and lighter designs. Packaging solutions are also trending toward multi-lead configurations, thinner profiles, and finer lead pitches. As product designs become more compact, tolerances continue to tighten, placing increasingly stringent demands on manufacturing precision. The 144-cavity semiconductor packaging mold sample exemplifies a uniformly fine and consistent surface finish that meets these high-precision requirements.
Machining Case Study
Precision multi-cavity machining technology to meet the demands of the semiconductor industry
In large-area or multi-cavity packaging mold applications, surface roughness consistency and dimensional accuracy are critical factors affecting the flatness of the final product. NEUAR’s expert system provides a dedicated machining program for multi-cavity processing using a single electrode with identical shapes. This ensures uniform surface texture and outstanding precision for each cavity, perfectly meeting the high standards of the semiconductor industry.
Depth error within 3μm across 144 cavities
Achieve high-precision machining with consistent surface roughness and depth across all cavities.
Simple Operation, Rapid Generation of Multi-Cavity Mold Machining Programs
Even with no IC packaging machining experience, operators can quickly generate machining programs using build-in application module. The intuitive system design significantly lowers the learning curve, making machining more efficient and convenient to meet various IC packaging requirements.
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Download 144 Cavities of Semiconductor Packaging Mold | NEUAR EDM
The new AE II discharge power system breaks past limits and streamlines programming in 5 steps. Achieve ultra-fine mirror surfaces around Ra 0.06–0.08 µm without adding powder; HQM2 expands large-area finishing, cutting post-polish time and cost.
SPRUE module targets mirror-finish angled gates with excellent stability. AE II auto-generates Z-axis linear and 3-axis paths; the C-axis refines angles for precision molds. For IC packaging molds, the large-area fine circuit keeps overall Ra within ±10% of target—ideal for high-density, tight-tolerance tooling.
Hard-alloy circuits suppress wear on ultra-hard materials; SH2’s tungsten-carbide thread circuit completes internal threads with a single electrode. High-speed gap monitoring speeds graphite electrode finishing, while EtherCAT control enables Z-axis jumping to 18 m/min for efficient deep-hole machining—request tech notes or a live demo.
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