250mm Long Semi-Conductor IC Packaging mold | NEUAR EDM
IC packaging molds equipped with the AE II large-area fine machining circuit deliver stable and high-speed processing results. Under these conditions, the overall surface roughness of the IC packaging molds can be consistently maintained within a ±10% deviation from the target Ra value. AE II core tech delivers powder-free mirror finish to Ra 0.06–0.08 µm, 5 µm corners, ±10% Ra control and 18 m/min Z-jump for deep holes. See HQM2, SPRUE & book a demo.
250mm Long Semi-Conductor IC Packaging mold
Core Technology of Automated High-Speed EDM Machines
IC packaging molds equipped with the AE II large-area fine machining circuit deliver stable and high-speed processing results. Under these conditions, the overall surface roughness of the IC packaging molds can be consistently maintained within a ±10% deviation from the target Ra value.
Machining Case Study
Latest Gap Control Technology
- Equipped with "Large Area Finishing circuit(LAF)", can achieve stable and high machining speed in large area.
- High Stability: Precisely controls the discharge gap to ensure a smooth and uninterrupted processing.
- High-Speed Processing: Enhances efficiency and shortens processing time.
- Consistent Surface Quality: The overall roughness in large-area processing can be consistently controlled within a ±10% deviation from the target Ra value.
Flatness within 5 μm
Exceptional precision machining capability, meeting the extremely high accuracy requirements of semiconductor processes.
The most suitable surface texture for semiconductor packaging
- The expert system is equipped with intelligent processing capabilities for semiconductor multi-hole machining requirements:
- Automatic selection of the optimal processing conditions: Based on the processing area, it automatically matches the most suitable parameters without the need for manual adjustments.
- Simplified operation process: Reduces setup time and improves processing efficiency. This module is specifically designed for semiconductor processing, ensuring stability and high performance, allowing you to focus on your core production and easily achieve high-quality results
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Download 250mm Long Semi-Conductor IC Packaging mold | NEUAR EDM
The new AE II discharge power system breaks past limits and streamlines programming in 5 steps. Achieve ultra-fine mirror surfaces around Ra 0.06–0.08 µm without adding powder; HQM2 expands large-area finishing, cutting post-polish time and cost.
SPRUE module targets mirror-finish angled gates with excellent stability. AE II auto-generates Z-axis linear and 3-axis paths; the C-axis refines angles for precision molds. For IC packaging molds, the large-area fine circuit keeps overall Ra within ±10% of target—ideal for high-density, tight-tolerance tooling.
Hard-alloy circuits suppress wear on ultra-hard materials; SH2’s tungsten-carbide thread circuit completes internal threads with a single electrode. High-speed gap monitoring speeds graphite electrode finishing, while EtherCAT control enables Z-axis jumping to 18 m/min for efficient deep-hole machining—request tech notes or a live demo.
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